- 7-21-1, Hirai Edogawa-ku, Tokyo 132-0035, Japan
email, Tel. +81-3-3618-0368
- Our unique valve ensures reliable suction and release of a semiconductor wafer
- The well polished inner wall of the valve part minimizes particle generation
- The optically polished wafer tip provides excellent adhesion to a wafer
- The wand body can be easily detached from the tubing